varieties and specifications of LED products

LED packaging technology

According to different application needs, LED chips can be made through a variety of packages with different structure and appearance of the device, to produce a variety of color temperature, color rendering index, varieties and specifications of LED products. According to package it with a pin, LED pin type can be divided into packages and surface mount package types. Conventional low power LED in the package are: DIP DIP LED, Surface Mount SMD LED, Piranha Piranha LED and PCB integrated package. Power type LED semiconductor lighting the future core of the package is one current research focus. The following package on the form of several major shows:

(1) pin-type package with lead frame as the appearance of various package pin. Round-pin type LED package is commonly used. This package is commonly used epoxy resin as epoxy resin or silicon chip about 90% of the heat transfer from the lead frame to the printed circuit board (PCB), the re-circulated into the surrounding air. Epoxy resin diameter 7mm, 5mm, 4mm, 3mm and 2mm and other specifications. Beam angle (2θ1 / 2) in the range of up to 18 ~ 120 °.

(2) surface mount package, it is the second after the pin-type package, there's an important package. It is usually plastic chip carrier with lead (Plastic Leaded Chip Carrier, PLCC), the LED chip on the top of the grooves, the bottom of the sheet metal pin closure. LED surface-mount package, can solve the brightness, angle, flatness, consistency and reliability issues, LED packaging technology is an important direction of development.

(3) power type LED package power type LED sub-ordinary power LED (less than 1W) and W-class power LED (1W and above) are two. Among them, the W-class power LED lighting is the core of the future. Single-chip W-class power LED was first introduced by Lumileds in 1998, the company launched LUXEON LED, the package is the characteristics of the structure in the form of thermal isolation, the flip-chip (Flip Chip) silicon carriers with solder directly on the heat sink, and the use of reflective glass, optical lens and flexible clear plastic and other new structures and new materials.